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2012 year
Welcome to our Product/Process Change Notification (PCN) pages dating back to year 2002. To locate PCNs, please select year at right.
Each PCN provides Contact and Implementation Dates, Alert Category and Type, PCN Number, Title, Impact, Description of Change, and a complete list of products manufactured by Diodes, Inc. that are affected by the product/process changes indicated. To view PCN, please click PCN# .
To Automatically Receive PCN Notification / E-mail Alerts
Product/Process Change Notifications
| PCN# | Implementation Date | Alert Category | Title (Abbreviated) | Description Summary |
| PCN-2062 | April 22, 2012 | Discrete Semiconductors | Qualification of Additional Wafer Source and Additional Top Metal Wafer Process | Additional, equivalent wafer fab and fabrication processes have been established and qualified to ensure continuity of supply.
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| PCN-2070 | April 9, 2012 | Discrete Semiconductors | Qualification of "Diodes Technology (Cheng Du) Company Limited" (DTC) as an Additional Assembly & Test Site for SOT-23 Packaged Parts and Conversion to Copper Bond Wire on Select Discrete Products at Diodes SKE/DSH (Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai) | This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified "Diodes
Technology (Cheng Du) Company Limited" (DTC) located in the Chengdu Hi-Tech Industrial Development Zone (CDHT) in
Chengdu, China as an additional Assembly & Test Site for select SOT-23 packaged parts using Copper bond wire.
Established in December 2010, as a joint venture between Diodes Incorporated and Chengdu Ya Guang Electronic Company Limited, Diodes Technology (Chengdu) Company Limited (DTC) was formed to perform semiconductor manufacturing assembly and test functions, and is an expansion of the Company's existing manufacturing presence in China. Ramp to high volume production began in May of 2011. In addition, for part numbers marked with (*) in Table 1, Diodes has qualified Copper bond wire at Diodes SKE/DSH (Shanghai Kaihong Electronic Co./Diodes Inc. Shanghai) Assembly & Test Sites. Full electrical characterization and high reliability testing has been completed on representative part numbers built using Copper bond wire to ensure there is no change to device functionality or electrical specifications in the datasheet. |
| PCN-2072 | April 12, 2012 | Analog Semiconductors | Conversion to Copper Bond Wire on Selected Analog Products | This PCN is being issued to notify customers that Diodes is in the process of qualifying Copper bond wire for the part numbers listed in this PCN. In order to accommodate the Copper bond wire, the top metal thickness in the die on selected devices has been increased. Part numbers with increased top metal thickness are identified in Table 1 with the following criteria:
* Top metal thickness is increased from 0.8μm to 1.8μm. Full electrical characterization and high reliability testing will be completed using representative devices built with Copper bond wire and the increased top metal thickness (if applicable) to ensure there is no change to device functionality or data sheet electrical specifications. There will be no change to the Form, Fit, or Function of affected products. |
| PCN-2074 | August 12, 2012 | Analog Semiconductors | Additional Die Source, Die Shrink, and/or Copper Wire Conversion on Select Analog Products | This PCN is being issued to notify customers that Diodes is qualifying an additional die source, die shrink, and /or copper wire
for the devices listed in the Products Affected Section. The changes described will only be implemented after completion of full
electrical characterization and high reliability testing.
Qualification is conducted using representative devices built with the new bill of materials to ensure there is no change to device functionality or data sheet electrical specifications. There will be no change to the Form, Fit, or Function of affected products. |
| PCN-2076 | July 15, 2012 | Selected Analog Devices | Discontinuance of Selected Analog Devices with Suggested Drop-in Replacements | The parts listed below (with non-green mold compound) are being discontinued and replaced by already existing
and previously qualified part numbers with green mold compound. These parts have been in high-volume
production.
Green mold compound does not contain any halogens or Sb2O3 flame retardants. Products will remain 94-V0 compliant, 260ºC maximum reflow temperature for 30 sec (Total) and MSL 1. Full electrical characterization and high reliability testing was completed on representative replacement devices built with the green mold compound material to ensure no change to device functionality or data sheet electrical specification before shipment. A life-time buy opportunity is being provided until 15th July, 2012. The last shipment date for non-Green product is 15th August, 2012. |
| PCN-2077 | April 6, 2012 | Selected Discrete Devices | Discontinuance of Selected Discrete Devices with Suggested Drop-in Replacements If Available | The parts listed below are being discontinued. Some parts can be replaced immediately by already existing and
previously qualified part numbers. These parts have been in high-volume production.
No life-time buy opportunity is being offered. |